Provides a comprehensive overview of Integrated Circuit (IC) families, their characteristics, advantages, and applications.

Introduction

  • Integrated Circuits (ICs): Semiconductor wafers with thousands or millions of tiny resistors, capacitors, and transistors.
  • ICs can function as amplifiers, oscillators, timers, counters, computer memory, or microprocessors.
  • ICs are categorized as either linear analog or digital.

Digital ICs

  • Operate at defined levels or states, used in computers, networks, modems, and frequency counters.
  • Fundamental building blocks are logic gates, which work with binary data (logic 0 and logic 1).

Implementing Logic Circuits

  • Transistors: Building blocks of logic gates.
    • BJT (Bipolar Junction Transistors): One of the first types invented.
    • FET (Field Effect Transistors): Includes MOSFETs (Metal-Oxide Semiconductor Field Effect Transistors), which are of two types: NMOS and PMOS.

Moore’s Law

  • Predicted by Gordon Moore in 1965: The number of transistors on a die would double every 18 to 24 months, growing exponentially.

Package Density

  • SSI (Small Scale Integration): Few tens of components per chip.
  • MSI (Medium Scale Integration): Hundreds of transistors per chip.
  • LSI (Large Scale Integration): Thousands of transistors per chip.
  • VLSI (Very Large Scale Integration): Hundreds of thousands of transistors per chip.

Voltage and Current

  • High-state Gate:
    • ( V_{OH} ): Minimum high-level output voltage.
    • ( V_{IH} ): Minimum high-level input voltage.
    • ( I_{OH} ): High-level output current.
    • ( I_{IH} ): High-level input current.
  • Low-state Gate:
    • ( V_{OL} ): Maximum low-level output voltage.
    • ( V_{IL} ): Maximum low-level input voltage.
    • ( I_{OL} ): Low-level output current.
    • ( I_{IL} ): Low-level input current.

Power Dissipation

  • Power dissipation in logic ICs includes static and dynamic power dissipation, input power, internal power, drive power, and output power.

Fan-In and Fan-Out

  • Fan-In: Number of input signals to a gate.
  • Fan-Out: Ability of the output of one gate to drive the inputs of subsequent gates.

Current Sourcing and Sinking

  • Current-source: Driving gate produces outgoing current.
  • Current-sinking: Driving gate receives incoming current.

Noise Immunity

  • Ability of a logic circuit to tolerate noise voltage.
  • Rated according to the noise intensity at which equipment functions within permissible limits.

IC Families

  • Integrated Injection Logic (IIL): Uses multiple collector bipolar junction transistors, high noise immunity, operates by current.
  • Diode Transistor Logic (DTL): First commercially available IC logic family, basic circuit is the NAND gate.
  • Transistor Transistor Logic (TTL): Popular digital function ICs, basic circuit is the NAND gate with totem pole output stage.
  • Resistor Transistor Logic (RTL): First logic family, basic circuit is the NOR gate.
  • MOSFET (Metal-Oxide Semiconductor Field Effect Transistors): Includes NMOS and PMOS types.
  • CMOS (Complementary Metal-Oxide Semiconductor): Combination of n and p channel, high input resistance, high noise immunity, low static power, high density on chip.

Advantages and Disadvantages of CMOS

  • Advantages: Less power dissipation, high speed, low cost, economical operation.
  • Disadvantages: Power consumption increases with clock speed, higher noise.

IC Packaging

  • Final stage of semiconductor device fabrication, encasing the semiconducting material to prevent damage and corrosion.
  • Types of packages: Metal can, dual-in-line, ceramic flat.

Integrated Circuit Families – Lesson 16

Engineering Institute of Technology